SENIOR PROCESS MOL (WIRE BOND) ENGINEER

Job Description

JOB RESPONSIBILITIES:
• Responsible for sustaining & improving the Wire Bond Process
• Overall knowledge on electronics manufacturing and must be able to collect and analyze data in order to create engineering reports for New products and regular production.
• Monitor and maintain Assembly yield within KPI target.
• Key involvement in improving the systems to bring down scrap rate due to process excursions.
• Initiate process improvements through effective evaluations of test/yield data and manufacturing defects and make adjustments to process equipment accordingly.
• Program, troubleshoot and maintain manufacturing process equipment as required to meet the required yield target.
• Support engineering initiatives in evaluating: solders, epoxies, new equipment (installations) and recommend solutions both tactically and strategically.
• Develop Manufacturing Work Instructions and production routes along with Engineering change orders implementation when applicable.
• Knowledgeable in SPC and Risk Management/FMEA

JOB REQUIREMENTS:
• Bachelor of Science/ Engineering preferably majoring in Electronics or Electrical.
• Experience working in high mix and high volume manufacturing environment will be an added advantage.
• Good knowledge of process problem solving analysis.
• Good computer literacy and knowledgeable in SAS JMP, Minitab and SPC knowledge.
• Must exhibit a strong sense of analytical skills with hands on working attitude on machine troubleshooting will be an added advantage.
• Adaptable and flexible to rapid changes to the business needs of the company.
• Experience in supervising and leading a team of process personnel.

**Chinese preferred