asyarirusyaidi

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About Candidate

Location

Education

D
Diploma in Mechanical Engineering 2016-2019
Seberang Perai Polytechnic

Obtained 2.98 CGPA

B
Bachelor in Mechanical Engineering (Machine Manufacturing) Technology with honours 2020-2023
University Kuala Lumpur Malaysia-France Institute

Obtained 3.19 CGPA

Work & Experience

E
Engineering Intern 3/8/2022 - 13/1/2023
Inari Technology

-Worked in Molded Chip on Board (MCOB) Department - Responsible for daily buyoff and New Product Introduction (NPI) - Communicated effectively through all department - Assisted in creating report and analyzing yield

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